What we deliver
Post-silicon validation
Bring-up, functional and electrical validation, and PCIe, DDR/LPDDR, USB and MIPI interface validation. Detail on post-silicon validation.
Characterization
Shmoo plots, parametric sweeps and margin tests across PVT corners and material lots, with datasheet limits and guard-bands proposed from the data.
ATE test programs
Test plans, pattern conversion from ATPG and simulation, program development and debug in SmarTest or IG-XL, and release to production. See ATE test engineering.
Board-level and system-level test
Validation and evaluation board test, IEEE 1149.1 boundary scan, IEEE 1687 instrument access, and system-level test with real software loads. See board bring-up.
Test time reduction
Profiling test flows, multi-site and concurrent test, removing tests with no fallout using STDF history, and re-correlating after each change.
OSAT and ATMP test engineering
Program transfer, tester-to-tester correlation, yield and bin analysis, and production support alongside your OSAT's test floor.
Validation, characterization and production test
| Activity | Purpose | Where it runs | Typical output |
|---|---|---|---|
| Post-silicon validation | Prove the silicon meets its specification under real conditions | Lab benches with instruments, evaluation boards and software stimulus | Validation report, errata, root-cause analysis |
| Characterization | Measure parameter distributions across PVT corners and lots | Bench and ATE with temperature forcing | Characterization report, proposed datasheet limits |
| Production test (ATE) | Screen every die or package for manufacturing defects | Wafer probe and final test on V93000, UltraFLEX or J750 | Released test program, STDF data, yield and bin reports |
| System-level test | Catch defects structural tests miss, under real workloads | SLT handlers or system boards | SLT program, failure analysis data |
How we work
01
Join before tape-out
Review the validation plan, DFT architecture and test plan, so boards, load boards and probe cards are ready for first silicon.
02
Bring up and validate
Bring up first silicon, run the validation plan and log bugs with root-cause evidence for design and firmware teams.
03
Characterize
Sweep parameters across PVT corners and material lots, and propose test limits from the data.
04
Develop and correlate programs
Build the ATE program, correlate bench to tester and site to site, and release to the OSAT.
05
Support production
Analyse STDF yield data, reduce test time and maintain the program through silicon and package revisions.
India's assembly and test build-out
Assembly and test capacity in India is growing. Micron's ATMP plant at Sanand, an assembly and test facility rather than a wafer fab, was inaugurated on 28 February 2026, as reported by Morung Express. The Union Cabinet approved Semicon 2.0 on 15 July 2026 with an outlay of ₹1,27,500 crore, and ATMP/OSAT is one of its six pillars, according to Inc42 and the Prime Minister's Office.
Each new test floor needs ATE program developers, product and yield engineers and reliability engineers. Our work is test engineering, not test-floor infrastructure: engineers work on your testers, in your validation lab or with your OSAT. Background reading: ATE, post-silicon validation, DFT and semiconductor talent.
Toolchains our engineers work with
- Advantest SmarTest
- Advantest T2000
- Advantest V93000
- JMP
- NI PXI
- NI TestStand
- Python
- PyVISA
- Teradyne IG-XL
- Teradyne J750
- Teradyne UltraFLEX
Related work
Case studies →Fuzz and penetration testing an industrial gateway for the Cyber Resilience Act and IEC 62443-4-2
A recurring security test cycle for an industrial gateway: fuzzing, penetration tests and SBOMs mapped to IEC 62443-4-2 and the CRA.
Planning MIL-STD-810H and MIL-STD-461 pre-compliance for an indigenised rugged subsystem
Tailoring MIL-STD-810H and 461 requirements, writing procedures, running pre-scans and preparing a rugged LRU for its accredited lab campaign.
Closing DO-178C structural coverage with independent verification for a DAL B component
Independent verification closes statement and decision coverage, coupling analysis and tool qualification for a DAL B software component.
Further reading
All insights →Semicon 2.0 and the VLSI talent gap: hiring verification, DFT, post-silicon and ATE engineers
What Semicon 2.0's talent pillar changes for VLSI hiring, which roles stay scarce, and how fabless teams and OSATs can staff up.
Building an engineering or test team for a mid-market GCC in India
Ramp waves, dedicated team vs Build-Operate-Transfer, governance and the measures that matter for a mid-market GCC's engineering or test team.
Euro NCAP 2026 ADAS Testing: What Changes for SIL/HIL Test Plans and Test Capacity
Euro NCAP 2026 multiplies ADAS test variations. How to restructure SIL/HIL plans around ISO 34502 and OpenSCENARIO, and plan the capacity.
Frequently asked questions
What is post-silicon validation versus production test?
Post-silicon validation checks that a new design works as specified, using lab benches, instruments and real software on a small number of parts. Production test on ATE screens every manufactured part for defects in seconds, using structural and parametric tests built on the DFT. Validation finds design bugs; production test finds manufacturing defects.
What is ATE test program development, and how is test time reduced?
It is writing the program the tester runs: pin and timing setup, patterns converted from ATPG and simulation, parametric and functional tests, binning and datalogs. Test time is reduced by multi-site and concurrent test, reordering so failing parts fail early, removing tests with no fallout in STDF history and shortening settling times, each change re-correlated before release.
Which ATE platforms do your engineers work on?
Mainly Advantest V93000 with SmarTest and Teradyne UltraFLEX and J750 with IG-XL, the platforms most often named in Indian test job ads. Engineers also work with Advantest T2000 and with bench automation in Python and NI TestStand. Name your platform and software version at scoping so engineers are matched to it.
Do you need access to our tester or lab?
For execution, yes. Program development, pattern conversion and offline work can start without one, but correlation, characterization and release need tester time and real hardware. Engineers work in your lab, at your OSAT or remotely through a secured connection where your IT policy allows, so programs and data stay under your control.
Can you work with our OSAT?
Yes. Typical work is program transfer and release to the OSAT, correlation between your reference tester and theirs, probe card and load board issue handling, and yield and bin analysis from STDF data. Engineers can be placed near the OSAT during ramp-up, which matters as new ATMP capacity comes up in Gujarat and elsewhere in India.
When should validation and test engineers join a programme?
Before tape-out. Validation engineers need time to write the plan, review boards and build automation; test engineers need DFT and ATPG outputs to start the program and to specify load boards and probe cards. Joining at first silicon usually means the first weeks go on infrastructure rather than finding bugs.
Can we hire semiconductor test engineers on contract?
Yes. We recruit post-silicon validation, characterization, ATE and product engineers on contract, contract-to-hire or permanent terms. See semiconductor engineers for role profiles and screening, or semiconductor talent for how test and validation skills map to roles.
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